NCP2993
PACKAGE DIMENSIONS
WLCSP9 1.22x1.22
CASE 499BM ? 01
ISSUE O
PIN A1
REFERENCE
D
A B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
2X
2X
0.05 C
0.05 C
TOP VIEW
A2
DIM
A
A1
A2
b
D
E
e
MIN MAX
??? 0.66
0.17 0.24
0.40 REF
0.24 0.29
1.22 BSC
1.22 BSC
0.40 BSC
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.05 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
A1
PACKAGE
OUTLINE
9X b
0.05 C A B
0.03 C
C
B
e
e
0.40
PITCH
9X
0.25
0.40
PITCH
A
1 2 3
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP2993/D
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